生产线后端
互连
可靠性(半导体)
材料科学
表征(材料科学)
热的
可靠性工程
工作(物理)
联轴节(管道)
电子工程
计算机科学
光电子学
机械工程
纳米技术
复合材料
工程类
电介质
计算机网络
功率(物理)
物理
量子力学
气象学
作者
Melina Lofrano,Herman Oprins,Xinyue Chang,Bjorn Vermeersch,Olalla Varela Pedreira,A. Leśniewska,Vladimir Cherman,Ivan Ciofi,Kristof Croes,Seongho Park,Zsolt Tökei
标识
DOI:10.1109/irps48203.2023.10117701
摘要
Back end of line (BEOL) reliability strongly depends on the absolute temperature and temperature distribution in the interconnect lines. In this work, we present a holistic approach that combines experimental characterization, such as BEOL self-heating measurements and material properties characterization, with hybrid modeling to investigate the impact of BEOL design, materials, and technology options on the self-heating of the BEOL. The thermal coupling from Front End of Line (FEOL) to BEOL is also investigated in this work.
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