Novel full-scale model verified by atomic surface and developed composite microfiber and slurry polishing system

Polishing mechanisms between fibers of a polishing pad and slurry are elusive, rising a challenge to develop high-performance composite polishing system. To solve this challenge, a novel full-scale model is proposed from mm to nm, consisting of macro, meso, micro and nanoscale. The model is verified by atomic surface and developed composite microfiber and slurry polishing system. Prior to chemical mechanical polishing, fused silica was polished by ceria slurry. A novel polishing pad was prepared using microfibers with a diameter of 2.5 μm, and a novel green slurry contained silica abrasives, hydrogen peroxide, sodium carbonate, sorbitol and xanthan gum. After CMP, an atomic surface with Ra of 0.108 nm was achieved, and the thickness of damaged layer is 1.95 nm. In terms of the macroscale model suggested, the maximum stress on the microfiber pad decreased 417.7%, and the direct contact area increased 41.23% compared with those of a commercial nonwoven pad. The peak stress exceeded 1 MPa on the commercial pad, while it reduced to about one fourth on the developed microfiber pad, according to the mesoscale fiber-slurry model proposed. Reactive force field molecular dynamics simulations, i.e. nanoscale model, reveal that a slurry layer existing at interface effectively impedes direct contact between abrasives and fused silica. With increasing the polishing load, material removal mode transformed from an atom to atomic chains. The constructed full-scale model and developed composite polishing system provide new insights to analyze, design and manufacture high-performance polishing pads, slurry and system.