德拉姆
CMOS芯片
材料科学
光电子学
金属浇口
拓扑(电路)
电气工程
工程类
晶体管
栅氧化层
电压
作者
R. Ritzenthaler,E. Capogreco,Emmanuel Dupuy,Hiroaki Arimura,João P. A. Bastos,Paola Favia,Farid Sebaai,D. Radisic,Vy Thi Hoang Nguyen,G. Mannaert,Boon Teik Chan,Vladimir Machkaoutsan,Younggwang Yoon,H. Itokawa,M. Yamaguchi,Y. Chen,P. Fazan,S. Subramanian,A. Spessot,E. Dentoni Litta
标识
DOI:10.1109/vlsitechnologyandcir46769.2022.9830186
摘要
We report for the first time on a thermally stable High-k/Metal Gate (HKMG) low cost CMOS FinFET solution for DRAM peripheral applications, integrated with Si:P and Si 0.55 Ge 0.45 :B embedded Source/Drain (S/D). The baseline is fully compatible with DRAM peripheral constraints (e.g. higher thermal budget linked to the co-integration with the DRAM cells), and exhibits improved I ON (I OFF ) and short channel control performance over Planar HKMG. Finally, a gate stack solution for V TH tuning (Diffusion and Gate Replacement, D&GR) compatible with DRAM thermal budget and FinFET flow is demonstrated, with no degradation of EOT/Gate leakage/BTI and proven functionality of SRAM.
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