Lift-off patterning of thermoelectric thick films deposited by a thermally assisted sputtering method

We have demonstrated a patterning process for the fabrication of thermoelectric thick-film modules by a thermally assisted sputtering method (TASM) and a lift-off technique. Given the experimental requirements of TASM, poly(dimethylsiloxane) (PDMS) was used as the heat-resistant masks in the lift-off technique. After the film deposition, the PDMS lift-off mask was removed from the substrate. This process enables the fabrication of 30-µm-thick and 300-µm-wide Sb2Te3 and Bi2Te3 thick-film patterns. The increase in film thickness increased the power generated by the module, which was consistent with the theoretical value.