材料科学
复合材料
薄膜
光电子学
基质(水族馆)
制作
电介质
图层(电子)
陶瓷
作者
M. A. Girardi,Kenneth A. Peterson,Paul T. Vianco
出处
期刊:Journal of microelectronics and electronic packaging
[IMAPS - International Microelectronics Assembly and Packaging Society]
日期:2016-09-30
卷期号:13 (3): 136-142
摘要
Low temperature cofired ceramic (LTCC) technology has proven to be invaluable in military/space electronics, wireless communication, microsystems, medical and automotive electronics, and sensors. The use of LTCC for high-frequency applications is appealing due to its low losses, design flexibility, and packaging and integration capability. The LTCC thick film process is summarized, including some unconventional process steps such as feature machining in the unfired state and thin film definition of outer layer conductors. The LTCC thick film process was characterized to optimize process yields by focusing on the following factors: (1) print location, (2) print thickness, (3) drying of tapes and panels, (4) shrinkage upon firing, and (5) via topography. Statistical methods were used to analyze critical process and product characteristics to achieve the optimization goal.
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