合金
钨
材料科学
冶金
高熵合金
金属
铜
沉积(地质)
沉积物
生物
古生物学
作者
Tomasz Ratajczyk,Mikołaj Donten
出处
期刊:Materials
[Multidisciplinary Digital Publishing Institute]
日期:2024-03-27
卷期号:17 (7): 1513-1513
被引量:2
摘要
This study presents a calculation and comparison of Fe, Co, Ni and Cu deposition rates in the tungsten codeposition process based on the electrodeposition of numerous tungsten alloys. Eight different tungsten alloys containing from two to five metals were electrodeposited in constant conditions in order to compare the exact reduction rates. The calculated rates enabled control of the alloy composition precise enough to obtain a high-entropy WFeCoNiCu alloy with a well-balanced composition. The introduction of copper to form the quinternary alloy was found to catalyze the whole process, increasing the deposition rates of all the components of the high-entropy alloy.
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