材料科学
纵横比(航空)
沉积(地质)
碳纤维
聚焦离子束
样品制备
离子束辅助沉积
板层(表面解剖学)
透射电子显微镜
过程(计算)
示意图
样品(材料)
梁(结构)
复合材料
蚀刻(微加工)
纳米技术
弯曲
高碳
形态学(生物学)
化学气相沉积
制作
离子束
作者
Chunxiao Liu,Bingxing Wu,Lei Wei,Tim Johnson,Smith Gao
出处
期刊:
日期:2025-08-05
卷期号:: 1-5
标识
DOI:10.1109/ipfa65338.2025.11256544
摘要
A focused ion beam (FIB) based TEM lamella preparation technique specifically designed for high aspect ratio (HAR) samples, using generic E-beam compensatory carbon deposition method is demonstrated in this paper. It provides a comprehensive and reproducible implementation process with clear schematic workflow. The ultra-thin HAR lamella, 30 nm final thickness, prepared using this technique achieve precise endpoint, uniform thickness, and remain free from bending or damage, regardless of whether the etch holes are filled. Subsequent TEM analysis shows clear profiles in the region of interest with less curtaining effect and redeposition contamination.
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