Embedding of Power Electronic Components

The electrification of the power train of hybrid electric vehicles (HEV) and electric vehicles (EV) increases the power demand and the power dissipation of power electronic modules. The p2 Pack technology is an embedding technology for power devices such as metal-oxide-semiconductor field-effect transistor (MOSFETs) and insulated-gate bipolar transistors (IGBTs) that produce significant power losses during operation and have a low number of electrical contacts. The source of power losses is switching losses and conduction losses of the power electronic components. This chapter discusses basic package construction of the layer stack and explores p2 pack technology process flow. It also discusses package performance such as electrical performance, dynamic/switching losses, inverter efficiency, and thermal performance. The first generation of p2 Pack products will be based on low-voltage MOSFETs from Infineon, which were especially designed for embedding applications.