Photonic Packaging in High-Throughput Microelectronic Assembly Lines for Cost-Efficiency and Scalability
作者
Tymon Barwicz,Yoichi Taira,Ted W. Lichoulas,Nicolas Boyer,Hidetoshi Numata,Yves Martin,Jae-Woong Nah,Shotaro Takenobu,Alexander Janta-Polczynski,Eddie L. Kimbrell,Robert Leidy,Marwan Khater,Swetha Kamlapurkar,Sebastian Engelmann,Yurii A. Vlasov,Paul Fortier
出处
期刊：Optical Fiber Communication Conference日期：2015-01-01卷期号：: W3H.4-W3H.4被引量：9
标识
DOI：10.1364/ofc.2015.w3h.4
摘要
We demonstrate silicon photonic packaging that can be fully exercised in existing microelectronic packaging facilities. We show low optical loss and point towards notably improved assembly cost and scalability in both volume and optical port-count.
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