Deposition of Mesoporous Silicon Dioxide Films Using Microwave PECVD

Mesoporous silicon dioxide films have been shown to be well suited as adhesion-promoting interlayers for generating high-strength polymer–metal interfaces. These films can be fabricated via microwave plasma-enhanced chemical vapor deposition using the precursor hexamethyldisiloxane and oxygen as working gas. The resulting mesoporous structures enable polymer infiltration during overmolding, which leads to a nanoscale form-locking mechanism after solidification. This mechanism allows for efficient stress transfer across the interface and makes the resulting adhesion highly dependent on the morphology of the deposited film. To gain a deeper understanding of the underlying deposition mechanisms and improve process stability, this work investigates the growth behavior of mesoporous silica films using a multiple regression analysis approach. The seven process parameters coating time, distance, chamber pressure, substrate temperature, flow rate, plasma pulse duration, and pause-to-pulse ratio were systematically varied within a Design of Experiments framework. The resulting films were characterized by their free surface area, mean agglomerate diameter, and film thickness using digital image analysis, white light interferometry, and atomic force microscopy. The deposited films exhibit a wide range of morphological appearances, ranging from quasi-dense to dust-like structures. As part of this research, the free surface area varied from 15 to 55 percent, the mean agglomerate diameter from 17 to 126 nm, and the film thickness from 35 to 1600 nm. The derived growth model describes the deposition process with high statistical accuracy. Furthermore, all coatings were overmolded via injection molding and subjected to mechanical testing, allowing a direct correlation between film morphology and their performance as adhesion-promoting interlayers.