Scalable Fabrication of 3D Optical Re-distribution for Co-Packaged Optics using an Developed Nanoimprint Stepper

For high-density Co-packaged optics, we have proposed an active-optical package substrate, in which silicon photonics are embedded in the substrate with mirror-based optical re-distribution. In this study, imprint technology was introduced for fabricating micro-mirrors to enable high-throughput formation. The novel imprint stepper was developed, and the fabrication of micro-mirrors was demonstrated on a 75-mm-squared substrate in a single shot with an angle standard deviation of 0.736 degrees.In addition, the optical re-distribution with an imprint micro-mirror was fabricated on a silicon photonics chip, and 112 Gb/s PAM4 transmission was successfully demonstrated at 1310 nm, resulting in TDECQ values below 3.4 dB.