材料科学
薄脆饼
微晶
电阻率和电导率
热的
过程(计算)
热导率
领域(数学)
复合材料
光电子学
碳化硅
冶金
工作(物理)
作者
Anqi Wang,Xuefeng Han,Xiaodong Pi,Fan Weijun,Binjie Xu,Lingling Xuan,Shenzhou Lu,Deren Yang
出处
期刊:CrystEngComm
[Royal Society of Chemistry]
日期:2025-12-03
卷期号:28 (3): 706-713
摘要
Poly-SiC wafers with resistivity down to 12 mΩ cm were successfully prepared via PVT process by redesigning the thermal field and optimizing growth parameters and post-growth processing.
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