Synthesis and characterization of high temperature stable epoxy adhesive

For the integration of multi-chip module required thermally stable epoxy adhesive, the effects of clay incorporation on the thermal stability of cured epoxy adhesive were investigated. Various epoxy adhesives were prepared as a function of a number of epoxy rings and the amount of hardener. Based on the relationship between the glass transition temperature (Tg) and cross-linking density obtained from the curing mechanism analyzed by FT-IR, the epoxy adhesive with Tg higher than 200°C was synthesized by raising cross-linking density to the maximum. With the incorporation of clay, the curing reaction rate and the degradation of epoxy adhesive can be controlled. The epoxy/clay composite showed the higher height of tanδ peak than that of pure epoxy adhesive.