Fabrication and performance evaluation for resin-bonded diamond wire saw

Slicing is the initial procedure in silicon wafer manufacturing process. The cost of slicing process is about 30% of the total cost of chip fabrication. The effective approaches to decrease slicing cost are to reduce the slicing kerf loss and to decrease the thickness and breakage ratio of sliced wafer. The resin-bonded diamond wire saw has the advantages of uniform of abrasive protrusion height and the manufacturing process less impact on the core wire strength. It is expected to achieve a narrow kerf and ultra-thin wafer slicing of silicon crystal ingot with resin-bonded diamond wire saw. The aim of this paper is to develop high-performance resin-bonded diamond wire saw. Based on the analysis of fabrication process of resin bond diamond wire saw, the device for resin-bonded diamond wire saw manufacturing is developed. The mold in the fabrication device ensures the consistency of the wire saw outer diameter and the uniform of abrasive protrusion height. A test device for constant force feed slicing is developed for the slicing performance evaluation of resin-bonded diamond wire saw. The components of the coating layer materials of resin-bonded diamond wire saw are investigated via orthogonal test. Choosing the material removal rate, wire saw wear rate, coating layer binding force, and sliced surface roughness as evaluation indexes, the performance of developed resin-bonded diamond wire saw is evaluated. The optimal component ratio of the coating layer materials of resin-bonded diamond wire saw is obtained, and the verification test of the optimal component ratio of the coating layer materials is performed. The results of this paper are useful for the development of smaller-diameter diamond wire saw and high-quality slicing of optoelectronic crystal ingot.