材料科学
薄膜
光电子学
蓝宝石
椭圆偏振法
氮化镓
扫描电子显微镜
退火(玻璃)
光学
分析化学(期刊)
激光器
图层(电子)
纳米技术
化学
色谱法
物理
复合材料
作者
Wenwang Wei,Jiabin Wang,Yao Liu,Yi Peng,Mudassar Maraj,Biaolin Peng,Yukun Wang,Wenhong Sun
出处
期刊:Crystals
[Multidisciplinary Digital Publishing Institute]
日期:2020-05-30
卷期号:10 (6): 439-439
被引量:9
标识
DOI:10.3390/cryst10060439
摘要
Wide bandgap III-V compounds are the key materials for the fabrication of short-wavelength optical devices and have important applications in optical displays, optical storage devices and optical communication systems. Herein, the variable-angle spectroscopic ellipsometry (SE) measurements are performed to investigate the thickness and optical properties of beryllium-implanted gallium nitride thin films that have been deposited on (0001) sapphire substrates by using low-pressure metalorganic chemical vapor deposition (LPMOCVD). The film layer details are described by using Parametric Semiconductor oscillators and Gaussian oscillators in the wavelength range of 200–1600 nm. The thickness, refractive indices and extinction coefficients of the Be-implanted films are determined at room temperature. Analysis of the absorption coefficient shows that the optical absorption edge of Be-implanted films changes from 3.328 eV to 3.083 eV in the temperature range of 300–850 K. With the variable temperature, Eg is demonstrated to follow the formula of Varshni. A dual-beam ultraviolet–visible spectrophotometer (UV–VIS) is used to study the crystal quality of samples, indicating that the quality of rapid thermal annealing (RTA) sample is better than that unannealed sample. By transport of ions in matter (TRIM) simulation and SE fitting the depths of Be implanted gallium nitride (GaN) films are estimated and in good agreement. The surface and cross-section morphologies are characterized by atomic force microscopy (AFM) and scanning electron microscope (SEM), respectively. The surface morphologies and thickness measurements of the samples show that RTA can improve crystal quality, while increasing the thickness of the surface roughness layer due to partial surface decomposition in the process of thermal annealing.
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