218303 Study on thermal conductivity materials for the reduction of thermal contact resistance

This paper describes evaluation of thermal conductivity materials for the reduction of thermal contact resistance. Recently, performance of electronic equipments has improved. But generation of heat of the device has increased. Therefore, it is necessary to improve the cooling technology. Then, I have evaluated thermal interface material (TIM) in this study by customized experimental equipment. In this study, I have evaluated 3 types TIM (A, B, and C). As a result, C is most effective the reduction of thermal resistance when load on TIM is 0.4MPa and temperature of cooling water is 10[℃].