Neural tissue-microelectrode interaction: Brain micromotion, electrical impedance, and flexible microelectrode insertion

微电极 多电极阵列 神经假体 生物医学工程 材料科学 脑组织 刚度 电阻抗 电极 神经科学 化学 医学 复合材料 电气工程 工程类 生物 物理化学
作者
Naser Sharafkhani,Abbas Z. Kouzani,Scott Adams,John M. Long,Gaëlle Lissorgues,J. O. Orwa
出处
期刊:Journal of Neuroscience Methods [Elsevier BV]
卷期号:365: 109388-109388 被引量:26
标识
DOI:10.1016/j.jneumeth.2021.109388
摘要

Insertion of a microelectrode into the brain to record/stimulate neurons damages neural tissue and blood vessels and initiates the brain's wound healing response. Due to the large difference between the stiffness of neural tissue and microelectrode, brain micromotion also leads to neural tissue damage and associated local immune response. Over time, following implantation, the brain's response to the tissue damage can result in microelectrode failure. Reducing the microelectrode's cross-sectional dimensions to single-digit microns or using soft materials with elastic modulus close to that of the neural tissue are effective methods to alleviate the neural tissue damage and enhance microelectrode longevity. However, the increase in electrical impedance of the microelectrode caused by reducing the microelectrode contact site's dimensions can decrease the signal-to-noise ratio. Most importantly, the reduced dimensions also lead to a reduction in the critical buckling force, which increases the microelectrode's propensity to buckling during insertion. After discussing brain micromotion, the main source of neural tissue damage, surface modification of the microelectrode contact site is reviewed as a key method for addressing the increase in electrical impedance issue. The review then focuses on recent approaches to aiding insertion of flexible microelectrodes into the brain, including bending stiffness modification, effective length reduction, and application of a magnetic field to pull the electrode. An understanding of the advantages and drawbacks of the developed strategies offers a guide for dealing with the buckling phenomenon during implantation.
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