材料科学
制作
导电体
电导率
印刷电子产品
电阻率和电导率
数码产品
曲折
墨水池
纳米技术
烧结
微观结构
纳米颗粒
结块
3D打印
复合材料
光电子学
电气工程
多孔性
化学
物理化学
工程类
医学
替代医学
病理
作者
Eva S. Rosker,Michael T. Barako,Evan Nguyen,Don DiMarzio,Kim Kisslinger,Dah-Weih Duan,Rajinder Sandhu,Mark S. Goorsky,Jesse Tice
标识
DOI:10.1021/acsami.0c06959
摘要
Previous efforts to directly write conductive metals have been narrowly focused on nanoparticle ink suspensions that require aggressive sintering (>200 °C) and result in low-density, small-grained agglomerates with electrical conductivities <25% of bulk metal. Here, we demonstrate aerosol jet printing of a reactive ink solution and characterize high-density (93%) printed silver traces having near-bulk conductivity and grain sizes greater than the electron mean free path, while only requiring a low-temperature (80 °C) treatment. We have developed a predictive electronic transport model which correlates the microstructure to the measured conductivity and identifies a strategy to approach the practical conductivity limit for printed metals. Our analysis of how grain boundaries and tortuosity contribute to electrical resistivity provides insight into the basic materials science that governs how an ink formulator or process developer might approach improving the conductivity. Transmission line measurements validate that electrical properties are preserved up to 20 GHz, which demonstrates the utility of this technique for printed RF components. This work reveals a new method of producing robust printed electronics that retain the advantages of rapid prototyping and three-dimensional fabrication while achieving the performance necessary for success within the aerospace and communications industries.
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