亮度
剪裁(形态学)
残余物
扩散
波长
计算机科学
扩散过程
光学
数学
算法
材料科学
物理
哲学
语言学
热力学
知识管理
创新扩散
作者
Ming Wen,Xiaofan Feng,Zeng Qiang Zheng,Xiao Hu
摘要
The intensity and peak wavelength variations of the LEDs are the root causes for the non‐uniformity of mini‐LED panels. Even though per‐pixel 3X3 DeMura would improve the uniformity to some extent, the residual Mura when displaying high brightness or high saturation images is still no‐negligible due to clipping. The mixing up of the LED chips with different peak wavelength before soldering makes it possible for traditional error diffusion to reduce the residual Mura. An S‐CIELAB‐based nonuniformity evaluation model is applied to optimize the error diffusion process. Our optimized error diffusion method applies adaptive diffusion matrix instead of fixed parameter matrix to diffuse the error, and the averaged ΔE is reduced by 36% and 50% compared with that of DeMura with clipping and that of DeMura with traditional error diffusion method respectively.
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