Abstract In this paper, a first-order average temperature coefficient of resistance ( TCRave ) calculation model is established and analyzed based on the distribution of piezoresistive doping concentration in bulk silicon. Furthermore, by extracting the experimental results of the first-order TCRave of multiple research groups and combining the first-order TCRave calculation model, the new mobility model in the concentration range of piezoresistance (1 × 10 18 –1 × 10 20 at cm −3 ) is obtained by fitting. The first-order TCRave of five implantation concentrations under the same process is tested. The results show that the error between the first-order TCRave obtained based on the new mobility calculation model and the test results is within 5%. However, the first-order TCRave based on the Arora mobility model has a deviation of 104.6% under the implantation condition of 3.75 × 10 15 at cm −2 . At the same time, the effects of different annealing temperatures and time on the first-order TCRave at the implantation concentration of 8.5 × 10 13 at cm −2 are compared. The results show that a higher annealing temperature or longer annealing time is not conducive to reducing the first-order TCRave , but the difference is small.