电解抛光
深共晶溶剂
磷酸
乙二醇
共晶体系
计时安培法
材料科学
循环伏安法
线性扫描伏安法
抛光
电化学
铜
氯化胆碱
冶金
无机化学
化学工程
核化学
化学
电解质
有机化学
微观结构
电极
物理化学
工程类
作者
Tarek M. Abdel-Fattah,Jon Derek Loftis
标识
DOI:10.3390/suschem3020015
摘要
This study investigated and compared the acid-free electropolishing of copper with the state-of-the-art acidic electropolishing process. The acid-free medium used in this study is based on a deep eutectic solvent comprised of 2:1 ethylene glycol and choline chloride. The electrochemical study included voltammetry and chronoamperometry tests during the electropolishing process. The characterization techniques used were atomic force microscopy (AFM) and digital microscopy, and surface morphology comparisons summarized the electropolishing efficiency of phosphoric acid and acid-free deep eutectic solvent treatments for high-purity copper. Electropolishing copper with a deep eutectic solvent resulted in a mirror finish and a post-treatment surface that was 8× smoother than the original metal surface prior to electropolishing treatments with a smoothing efficiency of 91.1 ± 1.5%. This eco-friendly solution produced polished surfaces superior to those surfaces treated with industry standard acid electrochemistry treatments of 1 M H3PO4.
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