材料科学
合金
微观结构
软化
再结晶(地质)
冶金
软化点
电阻率和电导率
复合材料
古生物学
电气工程
生物
工程类
作者
Zhen Yang,Wanyu Wang,Jimiao Ma,Xingyu Liu,Feng Liu
出处
期刊:Journal of physics
[IOP Publishing]
日期:2022-04-01
卷期号:2256 (1): 012010-012010
被引量:1
标识
DOI:10.1088/1742-6596/2256/1/012010
摘要
Abstract Cu-Cr alloys with excellent mechanical and electrical properties have been used in many industrial fields. However, the weak heat resistance of Cu-Cr alloys is a considerable shortness. In this work, Cu-Cr-Ti alloy was fabricated by vacuum melting and plastic deformation. Mechanical property and electrical conductivity of Cu-Cr-Ti alloy were investigated after aging treatment. The results show that peak aging occurs when aging at 450 °C for 1 hour. The mechanism of performance changes are discussed. The softening temperature could be identified as 575 °C, according to percentage of hardness changes of peak-aged Cu-Cr-Ti alloy annealed at different temperature and time. The microstructure explained that the addition of Ti, which retards recrystallization, could enhance the softening resistance of Cu-Cr alloy.
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