材料科学
复合数
复合材料
蜂巢
纤维
蜂窝结构
碳纤维复合材料
碳纤维
作者
Jiaqi Zhou,Xiu‐Mei Zhang,Ye Zhang,Jialin Li,Bo Zhu,Xun Cai
标识
DOI:10.1016/j.compositesb.2025.112548
摘要
Carbon fiber reinforced polyether ether ketone (CF/PEEK) composites possess significant potential in the electronic information sector, where high demands for the integration of structural functionality are placed. This requirement endows the composites with not only superior interfacial structural properties but also excellent electromagnetic protection and thermal conductivity (TC). However, achieving synergistic optimization of structure and multifunctionality in composites is challenging. In this study, we fabricated CF@ZIF-67 through continuous manufacturing, leveraging its unique honeycomb structure to penetrate the resin matrix and enhance interfacial performance. The interlaminar shear strength (ILSS) of the CF@ZIF-67-3/PEEK composite reached a remarkable 101.96 MPa. Due to its high electrical conductivity , CF@ZIF-67 is an ideal candidate for constructing an efficient conductive network in electromagnetic protection. It enhances the transport efficiency of electrons and phonons within the matrix, thereby establishing a robust TC network. This enhancement led to a 68.52 % increase in the TC and a 28.39 % improvement in electromagnetic interference (EMI) shielding performance. Moreover, CF@ZIF-67 exhibited remarkable electromagnetic wave (EMW) absorption capabilities, achieving a minimum reflection loss (RL min ) of −69.40 dB and an effective absorption bandwidth (EAB) of 4.88 GHz. The approach of creating interfacial/thermal/electrical pathways presents a highly potential direction for the advancement of high-performance multifunctional materials in electronic applications. • The honeycomb-structured CF@ZIF-67 was prepared through continuous manufacturing. • The ILSS for composite increased by 69.16 %–101.96 MPa. • The TC and EMI shielding was enhanced by 68.52 % and 28.39 % respectively. • The EMW absorption performance is excellent, with a RL min of −69.40 dB and an EAB reaching 4.88 GHz. • High-performance multifunctional composites offer a promising route for the development of advanced electronic devices.
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