天然橡胶
频谱分析仪
材料科学
工艺工程
过程(计算)
复合材料
计算机科学
工程类
电气工程
操作系统
作者
C. Ajay,Dilip Dhupia,Saikat Das Gupta,Dipankar Chattopadhyay,Rabindra Mukhopadhyay
摘要
ABSTRACT This study introduces an advanced methodology for evaluating the heat‐generation properties of rubber compounds using a rubber process analyzer (RPA). A technique was developed to measure heat build‐up (HBU) by analyzing tan δ under constant energy input. The test was conducted in the RPA after in situ curing within biconical dies, ensuring precise measurement under controlled conditions. The influence of fillers, particularly carbon black (CB) loading and particle size, on HBU was examined in natural rubber (NR), styrene‐butadiene rubber (SBR), and a 50:50 NR/SBR blend. The tan δ values from the RPA were compared with standard laboratory methods, including temperature rise (Δ T ) from the Goodrich Flexometer, tan δ from dynamic mechanical analysis (DMA), rebound resilience, and hysteresis from a universal testing machine (UTM). A strong correlation ( R 2 > 0.9) between RPA‐derived tan δ and these conventional parameters confirmed the reliability of the proposed technique. This statistically validated approach offers an efficient and accurate method for assessing heat generation in rubber compounds, aiding in optimized compound design and performance enhancement.
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