THz imaging technique for nondestructive analysis of debonding defects in ceramic matrix composites based on multiple echoes and feature fusion

We propose a THz nondestructive analysis method based on multiple echoes and feature fusion. Conventionally, it is difficult to identify the debonding defects of the glue layer (II) due to the thin adhesive layer. To this end, a THz propagation model is established, and a quantitative method for determining the thickness of debonding defects based on multiple echoes is presented. The measurement error for preset defect thickness of 500 µm was 4%. Further, for determining the area of debonding defects, a feature fusion imaging algorithm is proposed to realize the lateral recognition of defects and quantitative analysis is used to improve the recognition ability of defects.