材料科学
导电体
光电子学
互连
硅
涂层
图层(电子)
串联
复合材料
计算机网络
计算机科学
作者
Y. Zemen,L. Podlowski,Stefan Wendlandt,Juergen Stegmann
标识
DOI:10.1109/pvsc43889.2021.9518596
摘要
In this paper we are reporting a new approach by using thermoplastically and electrically conductive coated wires (so-called TECC wires) to interconnect solar cells – it is a modified multi-wire technology. The typical process temperature range is 130°C – 180°C which makes it suitable for temperature sensitive solar cells such as silicon heterojunction (SHJ) or silicon-perovskite tandem solar cells. The wires consist out of a round copper core with a diameter of 280 µm which is covered by a very thin layer of silver for corrosion protection, and then surrounded by about 40 µm coating of an electrically conductive thermoplastic material. As many as required wires can be applied on the busbarless solar cells.
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