石墨烯
材料科学
薄脆饼
聚丙烯腈
纳米技术
聚合物
比例(比率)
传输(计算)
复合材料
计算机科学
量子力学
物理
并行计算
作者
Mingpeng Shang,Saiyu Bu,Zhaoning Hu,Yixuan Zhao,Junhao Liao,Chunyang Zheng,Wenlin Liu,Qi Lu,Fangfang Li,Haotian Wu,Zhuofeng Shi,Yaqi Zhu,Zhiying Xu,Bingbing Guo,Beiming Yu,Chunhu Li,Xiaodong Zhang,Qin Xie,Jianbo Yin,Kaicheng Jia
标识
DOI:10.1002/adma.202402000
摘要
The disparity between growth substrates and application-specific substrates can be mediated by reliable graphene transfer, the lack of which currently strongly hinders the graphene applications. Conventionally, the removal of soft polymers, that support the graphene during the transfer, would contaminate graphene surface, produce cracks, and leave unprotected graphene surface sensitive to airborne contaminations. In this work, it is found that polyacrylonitrile (PAN) can function as polymer medium for transferring wafer-size graphene, and encapsulating layer to deliver high-performance graphene devices. Therefore, PAN, that is compatible with device fabrication, does not need to be removed for subsequent applications. The crack-free transfer of 4 in. graphene onto SiO
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