Manipulating a novel epoxy‐based composite with core–shell rubber particles for designing a structural adhesive in aluminum–aluminum bonded joints

材料科学 环氧树脂 复合材料 热稳定性 胶粘剂 固化(化学) 缩水甘油醚 乳液聚合 极限抗拉强度 甲基丙烯酸缩水甘油酯 动态力学分析 傅里叶变换红外光谱 热重分析 微观结构 差示扫描量热法 聚合物 聚合 化学工程 双酚A 图层(电子) 物理 工程类 热力学
作者
Maryam Aliakbari,Omid Moini Jazani,Majid Moghadam,José Miguel Martín‐Martínez
出处
期刊:Polymers for Advanced Technologies [Wiley]
卷期号:35 (9) 被引量:3
标识
DOI:10.1002/pat.6564
摘要

Abstract Epoxy adhesives become very brittle after curing due to their high‐crosslinking degree. For increasing the toughness of epoxy adhesives, the addition of different toughening agents has been proposed. In this study the diglycidyl ether of bisphenol A (DGEBA)/dicyandiamide epoxy network has been modified by adding an emulsion latex containing core–shell rubber particles (CSPs) prepared by means of seeded emulsion polymerization. The CSPs consist of poly (butyl acrylate) (PBA) as core and methyl methacrylate (MMA) copolymerized with glycidyl methacrylate (GMA) as shell. The effects of adding various amounts of the emulsion latex on the mechanical properties, thermal stability, adhesion, and microstructure of the cured epoxy resin were investigated. The CSPs were analyzed by transmission electron microscopy (TEM), Fourier‐transform infrared spectroscopy (FTIR), and differential scanning calorimetry (DSC). The mechanical properties, thermal stability, adhesion to aluminum plates, and microstructure of the cured epoxy resin were investigated by stress–strain, thermal gravimetric analysis (TGA), single lap shear test, and field emission scanning electron microscopy (FESEM), respectively. The addition of 7 wt.% emulsion latex to epoxy enhanced the tensile strength and the toughness of the dumbbell‐shaped samples by 421% and 4388% with respect to neat epoxy, respectively. Furthermore, the single lap shear strength increased in 33% and an increase of 71°C in the initial decomposition temperature of the epoxy was obtained by adding 7 wt.% CSP, without affecting the maximum decomposition temperature. The FESEM micrographs of the fractured surfaces indicated that the major toughening mechanisms were CSP de‐bonding, plastic void growth, and shear bond yielding.
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