单片微波集成电路
放大器
多波段设备
电气工程
功率(物理)
对偶(语法数字)
光电子学
材料科学
电子工程
工程类
物理
CMOS芯片
天线(收音机)
量子力学
文学类
艺术
作者
Qi Cai,Dingyuan Zeng,Haoshen Zhu,Quan Xue,Wenquan Che
摘要
ABSTRACT This letter presents a design of a dual‐band power amplifier (PA) monolithic microwave integrated circuit (MMIC). A modified dual‐band component based bias integrated dual‐band matching circuit is employed for both input and output network to achieve small size and low loss. For demonstration, one dual‐band PA is designed using 0.15 μm GaN‐on‐SiC process at 28/39 GHz. The fabricated PA achieves peak output power of 31.4 and 29 dBm at the measured frequency of 26 and 36 GHz, respectively, while the measured maximum drain efficiency (DE) is 51.1% and 27.8% at the two frequencies. The proposed dual‐band PA occupies an area of 1.4 mm × 1 mm including pads.
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