卤化物
材料科学
耐久性
稳健性(进化)
半导体
胶粘剂
工程物理
纳米技术
机械工程
复合材料
计算机科学
工程类
光电子学
化学
基因
图层(电子)
无机化学
生物化学
作者
Qing Tu,Do Yun Kim,Mohammed Shyikh,Mercouri G. Kanatzidis
出处
期刊:Matter
[Elsevier BV]
日期:2021-09-01
卷期号:4 (9): 2765-2809
被引量:78
标识
DOI:10.1016/j.matt.2021.06.028
摘要
Summary Metal-halide perovskites (MHPs) possess enormous potential in optoelectronic and semiconductor devices. In these applications, MHPs are often subjected to mechanical stress, resulting in distorted lattice, severe degradation, and catastrophic failure in MHPs and their interfaces. Understanding these mechanics-coupled stability issues is crucial to the durability and, thus, commercial viability of MHP-based devices. Here, we review the impact of mechanical stress on the integrity and robustness of MHP devices to provide insights into mitigating the mechanics-coupled stability issues. We start with an overview of the structure-elastic-property relationship of MHPs, after which we discuss the current understanding of the cohesive and adhesive failures within MHPs and at MHP interfaces forced by mechanical stress, respectively. We further review the chemical stability issues of MHPs and interfaces induced by the mechanical strain. Finally, we summarize the existing strategies to mitigate the mechanics-coupled stability issues and conclude with an outlook of future research directions.
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