Novel Flexible Films with High Gas Barrier Layers by Sputtering and ALD

Novel flexible films with high gas barrier layers deposited by sputtering and ALD (Atomic Layer Deposition) were developed, aiming at the application to flexible organic electronics devices. While single barrier layers deposited by sputtering or ALD showed poor gas barrier properties, alternatingly stacked barrier layers deposited by sputtering and ALD achieved high gas barrier properties with WVTR (Water Vapor Transmission Rate) values of the order of 10 ^-5 g/m ² /day or better. Flexible OLED devices were fabricated by using the developed barrier films.