热电效应
材料科学
塞贝克系数
凝聚态物理
热电材料
非谐性
电子能带结构
带隙
热导率
声子
电子结构
晶体结构
格子(音乐)
解耦(概率)
密度泛函理论
嵌套(过程)
电阻率和电导率
单斜晶系
态密度
Crystal(编程语言)
布里渊区
纳米技术
工作(物理)
作者
Shike Xu,Ying Zhu,Weiping Guo,Pengju Han,Shuyun Lou,Hongwei Ming,Yunpeng Zheng,Zhong-Zhen Luo,Zhigang Zou,Shike Xu,Ying Zhu,Weiping Guo,Pengju Han,Shuyun Lou,Hongwei Ming,Yunpeng Zheng,Zhong-Zhen Luo,Zhigang Zou
标识
DOI:10.1002/aenm.202505461
摘要
Abstract Exploring new materials with intrinsically low lattice thermal conductivity is significant in advanced thermoelectric materials. The complex crystal structures of low‐symmetry materials induce strong anharmonic vibrations of atoms and local crystallographic distortion, consequently leading to potentially ultralow lattice thermal conductivity. However, the low energy valley number and degeneracy near the VBM originating from low symmetry make it challenging to obtain high thermoelectric performance. In this work, the thermoelectric properties of monoclinic Cu 2 HfTe 3 for the first time is have prepared and characterized. To address this controversy in low‐symmetry Cu 2 HfTe 3 , the weak Ti─Te bonding is introduced, which optimizes the band structure and softens the lattice simultaneously. Density functional theory (DFT) calculations indicates Ti‐alloying triggers multiple electronic valleys and band nesting, effectively increasing valley degeneracy and density‐of‐states effective mass. Consequently, the Seebeck coefficient ( S ) and power factor (PF) are significantly enhanced, elevating the average PF from 4.81 to 6.43 µW cm −1 K −2 . Furthermore, the formation of hierarchical bonding reduces phonon group velocities. Collectively, these effects yield a remarkable ZT peak of 1.11 at 873 K, highlighting the promise of Cu 2 HfTe 3 as a thermoelectric material. This work presents an effective strategy for band engineering and decoupling of electron‐phonon transport in low‐symmetry thermoelectric materials.
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