Progress of Research on Micro Silica Filler for Copper Clad Laminate

In recent years, technology of inorganic filler is getting a main method to RD and improvement of performance in copper clad laminate (CCL). Silica filler compared to the other inorganic filler is getting more and more important too. In the paper, the patents about silica filler used in CCL were introduced. At the same, the progress of CCL technology about application of silica filler was reviewed.