Freeform thermoelectrics in single-step manufacturing: additive manufacturing of bismuth-telluride thermoelectrics

The project succeeded in producing crack-free Bismuth Telluride thermoelectric parts with density exceeding 98% through laser powder bed fusion (LPBF) additive manufacturing (AM).This greatly exceeded the highest previously reported density of 88% and is the highest among all semiconducting materials processed by LPBF.The additively manufactured material shows comparable Seebeck coefficient as conventional form and can be made into complex geometries with reduced material loss.On the other hand, measured properties are dramatically sensitive to the AM process parameters used, such that with identical composition, the Seebeck coefficient can be controllably tuned from +120 µV/K to -207 µV/K, which means the material switches between an n-type to a p-type semiconductor depending on processing.These changes are accompanied by significant differences in the as-processed microstructure due to rapid solidification.A machine learning protocol was developed and greatly reduced the experimental burden of the project, reducing the typical process optimization period of 2 years to 6 months.The project was fully successful in the objective of producing defect-free, complex geometry of bismuth-telluride parts through LPBF, but only partially successful in achieving performance goals.First, cost reduction of manufacturing, as measured by material waste, was successfully reduced by up to 70% compared to conventional manufacturing methods.This exceeded the proposed 30% reduction in materials waste needed to reach the 20% cost reduction goal of the project.On the other hand, the device performance, as measured by Seebeck coefficient, failed to reach the 40% improvement in efficiency.Rather, we observe comparable Seebeck coefficient between AM samples and conventionally processed counterparts.The device-level efficiency improvement does exceed 40% for complex geometry samples due to shape-induced increase in temperature gradients, but this was not the originally proposed metric.The machine learning approach developed in this project greatly accelerated the process optimization and can be adopted for fast development of AM processing parameters for other brittle and otherwise difficult-to-print materials.For the public, we deliver an efficient and widely adoptable process for incorporating waste-heat harvesting thermoelectric devices in both industrial and commercial heat exchangers.The geometric flexibility allows the capturing device to conform to the shape of the heat source to improve the system-level conversion efficiency.The technique can be Objective Metric Target Actual Single-step manufacturing Porosity Porosity < 5% Porosity < 2% Internal cracking no visible cracks no visible cracks Residual Stress <150 MPa <100 MPa annealed Improve efficiency by 40% Seebeck Coefficient Increase by 40% No change Reduce cost by 20% Material waste Reduced by 30% reduced by 70%