Preliminary study of particleboards manufactured with pine cones and Eucalyptus globulus capsules with a bio‐based polyurethane adhesive

胶粘剂 材料科学 辐射松 蓝桉 复合材料 聚氨酯 脲醛 肿胀 的 抗弯强度 辐射 桉树 植物 维格纳 生物 图层(电子)
作者
Andrea Wechsler,Mario Núñez‐Decap
出处
期刊:Polymer Composites [Wiley]
卷期号:43 (11): 8239-8249 被引量:3
标识
DOI:10.1002/pc.26995
摘要

Abstract The following research aims to evaluate the feasibility of manufacturing particleboards based in Pinus radiata D. DON (PC) and Eucalyptus globulus (EC) capsules bonded with a natural oil polyurethane adhesive (PU). The particles of PC and EC were ground and dried. Particleboards were manufactured with PC and EC bonded with a natural oil‐based polyurethane adhesive (PC–PU and EC–PU). Boards composed of radiata pine wood and bio based polyurethane adhesive (RP–PU) and with radiata pine wood bonded with urea formaldehyde resin (RP–UF) were manufactured as reference samples. The physical and mechanical properties and formaldehyde emissions were evaluated according to international standards. The superficial morphology of the particleboards was studied through optical microscopy (OP) and scanning electron microscopy (SEM). The novel particleboards showed high resistance to moisture, low thickness swelling and a high internal bond strength, when compared with particleboards manufactured with the radiata pine wood particleboards bonded with PU and UF. Flexural properties in the new particleboards were slightly lower than the flexural properties of the reference samples RP–PU and RP–UF, since the distribution and geometry of the particles were different. The results of this research validate the use of P. radiata D. DON cones and E. globulus capsules, bonded with a bio‐based polyurethane adhesive, for the manufacture of novel particleboards. This research opens the possibility of an alternative use for the pine cones and Eucalyptus capsules as a new prime source for the manufacture of particleboards and other composite materials.

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