Preparation of Cu@Ni‐P Composite Powders with Core‐Shell Structure and their High‐Temperature Resistant Properties

First, dendritic copper powder with an average particle size of 9.941 μm is prepared from laboratory electroplating waste containing copper through the electrodeposition method. Subsequently, core‐shell structured Cu@Ni‐P composite powders are synthesized using the electroless plating method, focusing on investigating the effects of various factors on the properties of the composite powders. A variety of characterization techniques, including X‐ray diffraction, scanning electron microscopy, energy dispersive spectroscopy, thermogravimetric analysis, and X‐ray photoelectron spectroscopy, are employed to conduct an in‐depth analysis of the micromorphology and properties of the composite powders. The research results indicate that the composite powders prepared under conditions of 10% dispersant content, 40% nickel content, pH 5, a temperature controlled at 85 °C, and ultrasonic power of 300 W exhibit excellent oxidation resistance, with an initial oxidation temperature of ≈450 °C, significantly superior to that of pure copper powder. Additionally, the prepared composite powder maintains excellent electrical conductivity even at a high temperature of 350 °C.