双金属片
磷化物
锡
阳极
铜
材料科学
钠
纳米颗粒
电阻率和电导率
无机化学
化学工程
冶金
化学
纳米技术
金属
电极
物理化学
工程类
电气工程
作者
Shuling Liu,Kang Feng,Wenxuan Xu,Jianbo Tong
摘要
The SnCuP/PC- X was prepared by one-step solvothermal phosphating method, in which the introduction of copper not only affected the morphology of SnCuP/C- X , promoted the electrical conductivity, but also inhibited the growth of tin particles.
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