材料科学
MOSFET
电介质
光电子学
电气工程
栅氧化层
高-κ电介质
栅极电介质
跨导
电子工程
晶体管
工程类
电压
作者
Prashant Kumar,Neeraj Gupta,Nitin Sachdeva,Tarun Kumar Sachdeva,Munish Vashishath
标识
DOI:10.5573/jsts.2020.20.3.297
摘要
The rapidly growth in semiconductor industry puts huge demand of scalable devices with low standby power for future VLSI chips. The further mitigation in device dimension becomes a challenging task due to the existence of unavoidable short channel effects. The introduction of gate stack and channel engineering in MOSFET devices open a new window for future generation devices. This paper presents gate stack structure with low-κ dielectric material as silicon oxide and replacement of various high-κ dielectric materials to analyze the device performance. The unification of new oxide material in the device enhances the immunity against SCEs and improves the gate leakage current. Dual-Halo Dual-Dielectric Triple Material Surrounding Gate (DH-DD-TM-SG) MOSFET has shown better performance with high dielectric constant materials. The device exhibits more value of transconductance with high-κ dielectrics.
科研通智能强力驱动
Strongly Powered by AbleSci AI