材料科学
复合材料
无定形固体
弯曲半径
溶胶凝胶
极限抗拉强度
无定形二氧化硅
薄膜
弯曲
化学工程
纳米技术
结晶学
化学
工程类
作者
Si‐Hoon Kim,Gyeong‐Seok Hwang,Donghwan Koo,Dong‐Hyun Seo,Ye-Pil Kwon,Hansuek Lee,Hyesung Park,Eun‐chae Jeon,Ju‐Young Kim
出处
期刊:Nano Research
[Springer Science+Business Media]
日期:2022-05-31
卷期号:15 (8): 7476-7483
被引量:6
标识
DOI:10.1007/s12274-022-4356-9
摘要
Silica thin films synthesized sol-gel process are proposed as flexible encapsulation materials. A sol-gel process provides a dense and stable amorphous silica structure, yielding an extremely high elastic deformation limit of 4.9% and extremely low water vapor transmission rate (WVTR) of 2.90 x 10(-4) g/(m(2).day) at 60 degrees C and relative humidity of 85%. The WVTR is not degraded by cyclic bending deformations for the bending radius corresponding to a tensile strain of 3.3% in the silica encapsulation film, implying that the silica thin film is robust against the formation of pinhole-type defects by cyclic bending deformations. Flexible organic solar cells encapsulated with the silica films operate without degradation in power conversion efficiency for 50,000 bending cycles for a bending radius of 6 mm.
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