聚酰亚胺
材料科学
玻璃化转变
极限抗拉强度
热塑性塑料
压缩成型
均苯四甲酸二酐
高分子化学
复合材料
电介质
溶解度
粘度
固有粘度
聚合物
特性粘度
有机化学
化学
模具
图层(电子)
光电子学
作者
Jinfeng Hu,Jianhua Wang,Shengli Qi,Guofeng Tian,Dezhen Wu
标识
DOI:10.1177/0954008319846237
摘要
A series of co-polyimide (co-PI) resins with distorted noncoplanar structure were carefully designed and successfully fabricated by copolycondensation of 2,3,3′,4′-biphenyltetracarboxylic dianhydride, 4,4′-oxydianiline (ODA), and 4,4′-(1,3-phenylenedioxy)dianiline (TPER). As-introduced asymmetric structure endowed these co-PI resins with excellent solubility and relatively low melt viscosity. Molecular simulation and dielectric analysis confirmed that the distorted noncoplanar structure induced a large amount of free volume. The minimum melt viscosity of co-PI resins decreased with increasing TPER content and reached 520 Pa·s at 400°C, indicative of good processability. Besides, the co-PI resins displayed outstanding thermal performance with glass transition temperature ranging from 256°C to 330°C and 5% weight loss temperature higher than 550°C in nitrogen atmosphere. Moreover, the co-PI sheets prepared by compression molding possessed tensile strength of 79.5–91.7 MPa and bending strength of 71.0–81.2 MPa when tuning the TPER/ODA ratio, with lower strengths observed at higher TPER content.
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