Synthesis and Electrochemical Properties of a Copper Plating Additive

Poly(N-vinylimidazole) was prepared by free radical polymerization of N-vinylimidazole,followed by its reaction with n-Butylbromide to obtain Poly(N-vinyl-N′-butyliimidazoliniumbromize).The structure was characterized by IR,HNMR and EA.The electrochemical properties were evaluated by cathodic polarization curve and EIS spectrum.The results indicate that the cation polymer compound can promote the copper cathode to be polarized and decrease the reduction potential of copper ion so as to make the copper grain reduced in size and more uniform and brighter.As a result,Poly(N-vinyl-N′-butylimidazoliniumbromize) may be a kind of perfect additive applied in copper plating of printed circuit board.