合金
铜
镍
冶金
材料科学
次磷酸
次磷酸钠
三乙醇胺
结晶
磷化物
无机化学
化学
复合材料
有机化学
分析化学(期刊)
图层(电子)
电镀
作者
Hidemi Nawafune,Takashi Uegaki,Shozo MIZUMOTO,Masami Ishikawa,Tsuneshi Nakamura
标识
DOI:10.1080/00202967.1998.11871231
摘要
SummaryStudies have been made of an electroless copper-nickel-phosphorus alloy from a citrate complex bath using hypophosphite as reducing agent and electroless copper-nickel binary alloy from a triethanolamine complex bath using formaldehyde as reducing agent. With an increase in copper content of alloy, the specific resistance of deposit decreased. The TCR of copper-nickel-phosphorus alloy increased remarkably because of the crystallization of Ni3P after heat treatment. But the increase in TCR of copper-nickel binary alloy was moderate and not so striking as for the phosphorus containing alloy.
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