模块化设计
数码产品
触觉传感器
微电子
计算机科学
柔性电子器件
接口(物质)
可伸缩电子设备
应变计
纳米技术
材料科学
电气工程
机器人
工程类
人工智能
气泡
最大气泡压力法
并行计算
操作系统
作者
Chen Xu,Yiran Wang,Jingyan Zhang,Wan Ji,Zehua Xiang,Zhongyi Nie,Jie Xu,Xiang Lin,Pengcheng Zhao,Yaozheng Wang,S Zhang,Jing Zhang,Chunxiu Liu,Ning Xue,Wei Zhao,Mengdi Han
出处
期刊:Science Advances
[American Association for the Advancement of Science]
日期:2024-08-21
卷期号:10 (34)
被引量:8
标识
DOI:10.1126/sciadv.adp6094
摘要
Flexible tactile sensors play important roles in many areas, like human-machine interface, robotic manipulation, and biomedicine. However, their flexible form factor poses challenges in their integration with wafer-based devices, commercial chips, or circuit boards. Here, we introduce manufacturing approaches, device designs, integration strategies, and biomedical applications of a set of flexible, modular tactile sensors, which overcome the above challenges and achieve cooperation with commercial electronics. The sensors exploit lithographically defined thin wires of metal or alloy as the sensing elements. Arranging these elements across three-dimensional space enables accurate, hysteresis-free, and decoupled measurements of temperature, normal force, and shear force. Assembly of such sensors on flexible printed circuit boards together with commercial electronics forms various flexible electronic systems with capabilities in wireless measurements at the skin interface, continuous monitoring of biomechanical signals, and spatial mapping of tactile information. The flexible, modular tactile sensors expand the portfolio of functional components in both microelectronics and macroelectronics.
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