Study on the rheological and polishing properties of electromagnetic two-phase composite particles with abrasive characteristics

Abstract Electromagnetic composite rheological polishing (EMRP) is a new ultra-precision machining technology that combines electro-rheological polishing (ERP) and magneto-rheological polishing (MRP). The key technology of the polishing method is the preparation of electromagnetic composite rheological fluid (EMRF) with both ERP and MRP, especially the preparation of composite particles with electro- and magneto-rheological effects. In this study, the EMRF was prepared by using electromagnetic two-phase particles with abrasive characteristics. The electromagnetic two-phase composite particles are synthesized in two steps: the coupling method and sol-gel method. The two-step method successfully prepared the electromagnetic two-phase composite particles with nano-diamond particles embedded randomly on the surface. The electro-rheological shear stress of EMRF can reach 160.7 Pa when the test parameter voltage is 2.5 kV, and magneto-rheological shear stress of EMRF can reach 4076 Pa when the electromagnet excitation current is 3 A. When a fused silica glass is polished under a single magnetic field, the material removal depth reaches a maximum of 2.7 μ m at a radius of 13.5 mm. Under the action of the electromagnetic compound field, the removal profile of the work-piece is smoother, and the material removal depth reaches the maximum value of 2.1 μ m at a radius of 10.5 mm. This proves that the stiffness distribution of the polishing pad under the electromagnetic composite field is more dispersed than that under a single field. Therefore, the distribution of electromagnetic two-phase composite particles can be controlled by applying an electromagnetic composite field, which provides a good foundation for the abrasive control technology of EMRP.