可加工性
材料科学
碳化硅
静水压力
晶界
流体静力平衡
碳化物
纳米-
机械加工
静水应力
倾斜(摄像机)
复合材料
冶金
微观结构
几何学
机械
结构工程
物理
工程类
有限元法
量子力学
数学
作者
Guanglan Hu,Weilong Wu,Houfu Dai
标识
DOI:10.1177/09544062221133302
摘要
To solve problems of low machining efficiency and surface/subsurface damage of silicon carbide (SiC), mechanisms of material dislodging and subsurface destruction of bicrystal SiC under nano-cutting were studied by using three-dimensional molecular dynamics (MD) simulation method. Effects of grain boundary (GB) tilt angle and cutting speed on stress, hydrostatic pressure, cutting force, temperature, and subsurface damage depth were analyzed. Results show that GB slope angle has important influence on the spread of strain, hydrostatic stress, and temperature, especially on subsurface damage depth. Specifically, with the increase in GB slope angle, subsurface damage layer decreases, and machined surface morphology improves. The machinability of small GB angle is better than the large GB angle, and the model with grain boundary angle of 4.24° has the best machinability. It is also found that with the increase in cutting velocity, the temperature increases, whereas cutting force and friction coefficient are reduced, which indicates that the increase in cutting velocity can effectively improve surface machined morphology. The research results provide a theoretical reference for future experimental research.
科研通智能强力驱动
Strongly Powered by AbleSci AI