Design space exploration (DSE) for over-136GB/s IO bandwidth with LPDDR5X SDRAM packages on SOC package in 200mm3

136 GB/s bandwidth system including LPDDR5X DRAM packages and SOC package will be presented. A new thermally enhanced configuration and structure with redistribution layer (RDL) based fan-out (FO) package is utilized to achieve small form-factor (SFF) interconnect system including LPDDR5 DRAM package supporting 8.533 Gb/sec/pin in a volume less than 200 mm ³ ,