符号
数学
电气工程
拓扑(电路)
材料科学
工程类
算术
作者
Hang Chen,Yourun Zhang,Peng He,Yuqiao Zhang,Shaohua Chen,Shiyan Li,Maojiu Luo,Zehong Li,Song Bai,Bo Zhang
标识
DOI:10.1109/ted.2023.3278624
摘要
The novel integrated temperature sensor of a power 4H-SiC MOSFET for precise real-time temperature monitoring is proposed in this article, in which a lateral Schottky barrier diode (SBD) is embedded. A physical model considering the influence of the lateral-distribution effect and interface states of the lateral SiC SBD is presented to explain the mechanism and direct the design of the sensor. A high degree of linearity ( ${R}^{{2}}{)}$ is achieved, and the proposed sensor obtains high design and fabrication tolerance and integration flexibility, namely, a much smaller size is viable. Specifically, the ${R}^{{2}}$ of the fabricated sensor is 0.9999 in the range of 15°–200°. Under the protection of the p-well, the crosstalk value ( ${V}_{\text {cross}}{)}$ between the SiC vertical double-diffused metal-oxide-semiconductor field-effect transistor (VDMOS) and sensor is greatly suppressed, and ${V}_{\text {cross}}$ is less than ±1.87° when the VDMOS is switching. Self-heating tests are employed for comparison with the temperature-sensitive electrical parameter (TSEP) method and RC thermal resistance model method. The proposed sensor has the potential for integration into SiC modules and integrated circuits (ICs) to realize real-time temperature estimation with high precision and low noise.
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