GROWTH KINETICS OF Cu(Al) SOLID SOLUTION IN Al/Cu DIFFUSION COUPLES

The growth kinetics of the solid solution phase of aluminum in copper in diffusion couples of pure aluminum and copper has been investigated at 425°C using a scanning electron microscope. In the initial stage, the phase layer growth was found to obey the parabolic law, indicating that the rate-controlling process is diffusion. At longer times, the growth rate deviates from the kt -1/2 behavior of the early stage.