材料科学
功率(物理)
计算机冷却
散热片
光电子学
作者
G. M. Chrysler,R. C. Chu
出处
期刊:Springer US eBooks
[Springer Nature]
日期:1990-01-01
卷期号:: 881-887
标识
DOI:10.1007/978-1-4613-0639-9_105
摘要
The first part of this paper presents a summary of cooling technology for high power density electronic chips at room temperature. Both immersion and conduction cooling techniques are included. The second part of this paper is a survey of low temperature cooling technology for electronics as published by both university researchers and industry practitioners. The final part of the paper is an outline of a logical extension of room temperature cooling technology to the liquid nitrogen temperature regime. Emphasis is placed on a possible extrapolation of cooling capabilities based on room temperature models to low temperature applications. This paper draws input entirely from published information as listed in the references.
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