A fast and flexible software for IC reverse engineering
作者
Gyungtae Kim,Ming Ma,Inhag Park
出处
期刊:2018 International Conference on Electronics, Information, and Communication (ICEIC)日期:2018-01-01卷期号:: 1-4被引量:3
标识
DOI:10.23919/elinfocom.2018.8330639
摘要
This paper presents a fast and flexible CAD tool for Reverse Engineering (RE) in the semiconductor industry. It has applied various techniques such as the web-based service, big image acceleration algorithm, and automatic generation for circuit extraction. As a result of conducting the RE with the self-manufactured ROIC chip, it was confirmed that the analog circuit was exactly extracted as the gate level.